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E2C0011-27-Y4
Semiconductor MSC1164
Semiconductor 20-Bit Grid/Anode Driver
This version: Nov. 1997 MSC1164 Previous version: Jul. 1996
GENERAL DESCRIPTION
The MSC1164 is a monolithic IC using the Bi-CMOS process technology for hybridizing CMOS and bipolar transistors on the same chip. The logic portion such as the input stage, shift register and latch is fabricated by CMOS and the output driver requiring a high withstand voltage is fabricated by bipolar transistors. Since a 32-pin plastic SSOP package is used, the display unit size can be reduced.
FEATURES
The MSC1164 is designed as a VFD grid/anode driver with emitter-follower force output with 20-bit active pull-down and built-in 20-bit shift register and latch. * Logic Supply Voltage (VCC) : 5V : 65V * Driver Supply Voltage (VHV) * Driver Output Current IOHVH1 :-40mA (Only one driver output: "H") IOHVH2 :-2mA (All driver outputs: "H") IOHVL :2mA * 20-bit output (with latch circuit) * 20-bit shift register * Clock frequency : 4MHz * Package options: 32-pin plastic SSOP (SSOP32-P-430-1.00-K) (Product name: MSC1164GS-K) 30-pin plastic shrink DIP (SDIP30-P-400-1.78) (Product name: MSC1164SS)
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MSC1164
BLOCK DIAGRAM
CLK DIN LS CHG CL V CC V HV
D HVO1 R-1 1 1 HVO2 R-2 2 2
20-Bit Shift Register
20-Bit Latch
HVO20 R-20 Q 20 20
DOUT
GND
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MSC1164
INPUT AND OUTPUT CONFIGURATION
Schematic Diagrams of Logic Portion Input and Output Circuits Input Pin
VCC VCC
INPUT
GND
GND
Output Pin
VCC VCC
DOUT
GND
GND
Schematic Diagram of Driver Output Circuit
VHV VHV
HVO
GND
GND
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Semiconductor
PIN CONFIGURATION (TOP VIEW)
NC NC DOUT LS CL VCC HVO20 HVO19 HVO18 HVO17 HVO16 HVO15 HVO14 HVO13 HVO12 HVO11 1 2 3 4 5 6 7 8 9

10 11 12 13 14 15 16 NC: No-connection pin 32-Pin Plastic SSOP
MSC1164
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
NC CHG DIN CLK GND VHV HVO1 HVO2 HVO3 HVO4 HVO5 HVO6 HVO7 HVO8 HVO9 HVO10
NC 1 DOUT 2 LS 3 CL 4 VCC 5 HVO20 6 HVO19 7 HVO18 8 HVO17 9 HVO16 10 HVO15 11 HVO14 12 HVO13 13 HVO12 14 HVO11 15 NC: No-connection pin 30-Pin Plastic Shrink DIP
30 CHG 29 DIN 28 CLK 27 GND 26 VHV 25 HVO1 24 HVO2 23 HVO3 22 HVO4 21 HVO5 20 HVO6 19 HVO7 18 HVO8 17 HVO9 16 HVO10
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MSC1164
PIN DESCRIPTION
Function Driver Output Driver Power Supply Driver GND Logic GND Pin 26 - 7 27 28 Symbol HVO1 HVO20 VHV GND Description Driver output pin, applicable to each bit of shift register. Power supply pin for driver circuit. GND pin for the driver circuit. GND pin for the logic circuit. Clear input pin with pull-up resistor. Normally "H" level. In this condition, the driver outputs "H" or "L" according to the corresponding latch output level. Setting this pin to "L" enables the driver output to be fixed at "L" irrespective of latch output. Latch strobe input pin with neither pull-up nor pull-down resistor. When LS is "H", the output of the shift register becomes that of the latch circuit. When LS is "L", the latch circuit holds the contents of the shift register that are immediately before LS goes "L". Shift register input pin with neither pull-up nor pull-down resistor. Display data is input in synchronization with clock. (Positive Logic) Power supply pin for logic (except driver). VCC should be 4.5V to 5.5V. Serial output pin for shift register. Clock input pin. Data of shift register is shifted from one stage to the next at the rising edge of clock. Test input pin with a pull-down resistor. Normally "L". If CL = "H" in this condition, the driver outputs "H" or "L" according to the corresponding latch output.
Clear Input
5
CL
Latch Strobe Input
4
LS
Data Input Logic Power Supply Data Output Clock Input
30 6 3 29
DIN VCC DOUT CLK
Test Input
31
CHG
Note:
Pin numbers shown are for 32-pin plastic SSOP.
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Semiconductor
MSC1164
ABSOLUTE MAXIMUM RATINGS
Parameter Logic Supply Voltage Driver Supply Voltage Input Voltage Data Output Voltage Driver Driving Frequency Power Dissipation Thermal Resistance of Package Storage Temperature Symbol VCC VHV VIN VOD fDRV PD Rj-a TSTG Condition Applicable to logic supply voltage pin Applicable to driver supply voltage pin Applicable to all input pins Applicable to data output pin Duty cycle 50% max Ta 25C -- -- Rating -0.3 to +65 VCC to 70 -0.3 to VCC +0.3 -0.3 to VCC +0.3 0 to 15 790 158 -55 to +150 Unit V V V V kHz mW C/W C Note 1 1, 2 1 1 -- -- 3 --
Notes: 1) Maximum Supply Voltage with respect to GND 2) Stresses beyond "Absolute Maximum Rating" may cause permanent damage to the device. 3) Thermal resistance of the package (between junction and atmosphere) The junction temperature (Tj) expressed by the equation below must not exceed 150C. Tj=P Rj-a+Ta (P: Maximum power consumption)
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Semiconductor
MSC1164
RECOMMENDED OPERATING CONDITIONS
Parameter Logic Supply Voltage Driver Supply Voltage High Level Input Voltage Low Level Input Voltage High Level Driver Output Current High Level Driver Output Current Low Level Driver Output Current CLK Frequency CLK Pulse Width Data in Setup Time Data in Hold Time LS Pulse Width CLK-LS Delay Time LS-CLK Delay Time LS-CHG Delay Time LS-CL Delay Time CHG Pulse Width CL Pulse Width Operating Temperature Symbol VCC VHV VIH VIL IOHVH1 IOHVH2 IOHVL ff tWCLK tDS tDH tWLS tDCL tDLC tDLCG tDLCL tWCHG tWCL Top Condition Applicable to logic supply voltage pin Applicable to driver supply voltage pin Applicable to all input pins Applicable to all input pins VCC=4.5V VCC=5.5V VCC=4.5V VCC=5.5V Min. 4.5 10 3.6 4.4 -- -- -- -- -- -- 75 50 50 80 50 0 0 0 2 2 -40 Max. 5.5 65 -- -- 0.9 1.1 -40 -2 2 4 -- -- -- -- -- -- -- -- -- -- 85 Unit V V V V V V mA mA mA MHz ns ns ns ns ns ns ms ms ms ms C
Only one driver output is High Other driver outputs are High All driver output pins are High Applicable to all driver output pins See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram See timing diagram --
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MSC1164
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC=5V10%, VHV=10V to 65V, Ta=-40C to +85C) Parameter Logic Supply Current Symbol ICC1 ICC2 IHV1 Driver Supply Current IHV2 VIH VIL IIN CIN VODH1 VODL1 VODH2 VODL2 VOHVH VOHVL IO=-20mA IO=20mA IO=-0.1mA IO=0.1mA No load VCC=5.5V No load VCC=5.5V -- -- Condition All input: Low All input: High, All driver output: High, Ta=25C All driver output: Low All driver output: High, Ta=25C VCC=4.5V VCC=5.5V VCC=4.5V VCC=5.5V Ta=25C Ta=25C VCC=4.5V VCC=5.5V VCC=4.5V VCC=5.5V VCC=4.5V VCC=5.5V VCC=4.5V VCC=5.5V IOHV=-40mA IOHV=2mA Min. -- -- -- -- 3.15 3.85 -- -- -- -- 4.2 5.2 -- -- 3.5 4.5 -- -- VHV-4 -- Typ. 2.3 0.5 -- 1.3 -- -- -- -- -- 15 -- -- -- -- -- -- -- -- -- -- Max. 3.4 1.0 1 2.0 -- -- 1.35 1.65 1 -- -- -- 0.2 0.2 -- -- 1.1 1.1 -- 3.0 mA mA mA V V V V mA pF V V V V V V V V V V Unit
High Level Input Voltage Low Level Input Voltage Input Leakage Current Input Capacitance High Level Data Output Voltage Low Level Data Output Voltage High Level Data Output Voltage Low Level Data Output Voltage High Level Driver Output Voltage Low Level Driver Output Voltage
AC Characteristics
(VCC=5V, VHV=65V, Ta=25C) Parameter CLK-DOUT Delay Time Delay Time Low to High Transit Time Low to High Delay Time High to Low Transit Time High to Low Symbol tPD tDLH tTLH tDHL tTHL Remarks See timing diagram and test circuit See timing diagram and test circuit See timing diagram and test circuit See timing diagram and test circuit See timing diagram and test circuit Min. -- -- -- -- -- Typ. 100 0.3 2 0.3 2 Max. 150 1 5 1 5 Unit ns ms ms ms ms
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TIMING DIAGRAM
Semiconductor
1/f f CLOCK T1/2 tDS tDH DIN tWD DOUT tDCL tWLS LS tDLCG CHG tWCHG tDLCL CL tDLH HVO (1, 2, 19, 20) tDLH tDHL tDHL 90% 10% 90% 10% tTLH tTLH tTHL tTHL tTLH tDLH tWCHG tWCL tWCL tDLC tPD tPD T3/4 T(19,20) tDS tDH T1/2 tWCLK tWCLK T3/4
HVO (OTHERS)
MSC1164
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Semiconductor Test circuit
MSC1164
20pF V CC V HV HVO1 1.5kW HVO2
65V
5.0V HVO20
GND
CHG
CLK
DIN
DOUT
LS
CL
30pF
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MSC1164
FUNCTIONAL DESCRIPTION
Function Table
CLK
DIN H L
R-1 H L
R-2 R1n R1n
R-3 R2n R2n
R-4 R3n R3n
***************
R-20 R19n R19n
DOUT R19n R19n
CL L H H H H
CHG X H L L L
LS X X H H L
R.X X X H L X
HVO.X L H H L NC
L: Low Level, H: High Level, X: Don't Care, NC: Change
NOTES ON USE
1. The MSC1164 is designed as a grid/anode driver of VFD. The data applied to the data input pin is read into the shift register at the rising edge of the clock and shifted sequencially to the shift register synchronizing with the clock. The shift register output drives the output driver, passing through the latch and the NOR circuit. Setting the CL pin to "L" makes all driver outputs go into "L". This function can be used for setting display blanking. The contents of the shift register are undefined after power is turned on. Therefore, two or more driver outputs may go into "H" at the same time after power-on. (If it happens, an overloading beyond the power dissipation limit may occur to cause a device break-down.) To avoid this, take the following procedure: 1) Turn on the power of the logic portion while holding the CL pin to "L". 2) Turn on the power of the driver portion. 3) Apply a "L" level signal to the DIN pin and send clock pulses by the specified number of grids to reset ("L") the entire contents of the shift register. 4) Initialize the driver outputs to "L".
2.
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PACKAGE DIMENSIONS
(Unit : mm)
SSOP32-P-430-1.00-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.60 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSC1164
(Unit : mm)
SDIP30-P-400-1.78
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.80 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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